• QQ: 1811068585
  • Hotline: +86 13275595566
136779-29-8

1680206-12-5
1680206-12-5 / 98%
Copper, (2,2’-Bipyridine-Κn1,Κn1’)Tris(Trifluoromethyl)- 联吡啶三(三氟甲基)铜




1147315-11-4
1147315-11-4 / 98%
Tetrabutylammonium tris(3-chloro-4-methylphenyl)hexylborate 三(3-氯-4-甲基苯基)己基硼酸四丁基铵
-

2454490-97-0
2454490-97-0 / 95%
(8-Chloro-3-(methoxymethoxy)naphthalen-1-yl)trimethylstannane (8-氯-3-(甲氧基甲氧基)萘-1-基)三甲基锡烷

81675-81-2
81675-81-2 / 98%
Phosphazene base P1-t-Bu 磷腈配体 P1-叔丁基

2056881-46-8
2056881-46-8 / 98%
(±)-3,5-bis-TMS-SEGPHOS

1440435-02-8
1440435-02-8 / 98%
N,N’-bis(di(3-pentyl))diazabutadiene N,N’-双(二(3-戊基))二氮杂二烯

55562-83-9
55562-83-9 / 2.0 M solution in THF, SpcSeal
Sodium methylcyclopentadienide 甲基环戊二烯钠
-
55562-83-9 / 1.3M solution in THF, SpcSeal
Sodium methylcyclopentadienide 甲基环戊二烯钠
-

N/A
N/A / 2.0 M solution in THF, SpcSeal
Sodium ethylcyclopentadienide 乙基环戊二烯钠
N/A / 2.2 M solution in THF, SpcSeal
Sodium ethylcyclopentadienide 乙基环戊二烯钠




1218788-80-7
1218788-80-7 /
Iodo[1,1′-(9,9-dimethyl-9H-xanthene-4,5-diyl)bis(1,1-diphenylphosphine-P)]copper(I) Cu(Xantphos)I

120307-06-4
120307-06-4 / 97%
tetrabutylammoniumbutyltriphenylborate 四丁基三苯基硼酸铵
-


1402393-56-9
1402393-56-9 / 95%
2-Bromo-2’,4’,6’-Triisopropyl-3,6-Dimethoxy-1,1’-Biphenyl 2-溴-2’,4’,6’-三异丙基-3,6-二甲氧基-1,1’-联苯
-

33937-26-7
33937-26-7 / 97%
Tetrakis(triethylphosphine)platinum 四(三乙基膦)铂
-